On 03–04 March 2026, 127 researchers and industry experts gathered at the SuperC at RWTH Aachen University for the 2nd workshop “2D Materials for Future Electronics.” The event proved to be a great success, bringing together a vibrant community to exchange ideas and explore emerging developments in the field.
Over the course of two days, participants engaged in lively discussions and open dialogue. The workshop atmosphere was shaped by inspiring perspectives and a shared enthusiasm for advancing research on 2D materials. Once again, the event demonstrated how valuable such formats are for fostering collaboration and innovation within the community.
Highlights from the Invited Talks
A special highlight of the workshop was the series of presentations delivered by outstanding researchers from across Europe:
- Jean‑François Dayen (University of Strasbourg) presented his research on reconfigurable electronics based on ferroelectric 2D materials and introduced the EU Pathfinder project 2DFERROPLEX.
- Sergi Abadal (Universitat Politècnica de Catalunya) discussed how 2D materials can enable new frontiers in communications and computing. His talk covered advances from the WiPLASH project, his ERC project WINC, and the EU Pathfinder initiative CERBERUS.
- Inge Asselberghs (imec) introduced the 2D Materials Pilot Line, highlighting its role in accelerating industrial-scale integration of 2D materials.
- Gordon Rinke (AMO GmbH) presented the current open calls for Multi Project Wafer (MPW) runs.
- Mikka Soikkeli (VTT Technical Research Centre of Finland) shared insights into VTT’s ongoing efforts to integrate sensor technologies based on 2D materials on CMOS platforms.
- Nadine Collaert (imec) delivered an inspiring talk titled “The Good, The Bad, and The MX₂: Benchmarking 2D Materials Against the Semiconductor Giants.”
- Aníbal Pacheco (University of Granada) presented results on graphene devices for energy-efficient radio-frequency electronics, including measurements on devices fabricated within the 2D Pilot Line and the INFRACHIP project.
- Sarah Riazimehr (Oxford Instruments) provided a deep dive into process integration in her talk “From Surface Cleaning to Dielectric Integration: Plasma Enhanced ALD on 2D Materials.”
- Max Lemme (AMO GmbH / RWTH Aachen University) introduced the collaborative research center TRR 404 ACTIVE-3D, outlining its vision and ongoing work on the fundamentals and future applications of 2D materials.
- Gianluca Fiori (University of Pisa) discussed 2D materials as a platform for next-generation devices and conformable electronics, and introduced the EU Pathfinder project 2D-ADDICT.
- Dmitry Polyushkin (TU Wien) presented recent results on encapsulated hBN/MoS₂/hBN FETs, demonstrating excellent stability and low hysteresis.
- Johan Liu (Chalmers University of Technology) explored the potential of graphene for innovative solutions in electronics packaging and thermal management.
- Jinxin Liu (TU Dresden) introduced 2D conjugated metal-organic frameworks as a promising approach for back-end-of-line (BEOL) integration.
- Susanne Hoffmann‑Eifert (Forschungszentrum Jülich) presented results from the NeuroSys and NEUROTEC projects on volatile memory cells for neuromorphic applications based on MOCVD-grown h-BN.
- Finally, Zhenxing Wang (AMO GmbH) provided a broad overview of AMO’s research activities related to the wafer-scale integration of 2D materials.
Poster Session
The workshop’s poster session proved equally engaging. With so many stimulating conversations, discussions continued well past the planned schedule—running beyond 9:00 pm as participants exchanged ideas and explored potential collaborations.
Acknowledgements
We would like to extend a heartfelt thank-you to our teams at AMO and ELD for their dedication and support in organizing the workshop. Their efforts were essential to making this event possible.
Funding
The workshop has been financially supported by the European Union via the projects 2D-ADDICT, 2D-PL, CERBERUS, and ENERGIZE, as well as by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation), via the Collaborative Research Center/Transregio TRR404 „Next Generation Electronics With Active Devices in Three Dimensions [Active-3D]“, and by the the BMFTR through the Cluster4Future NeuroSys and the project MoS2FET (grant number 01DK24018, part of the „Förderung von Projekten zum Thema Forschungs- und Entwicklungszusammenarbeit zwischen Deutschland und der Ukraine”). A sponsorhip by Oxford Instruments Plasma Technology is gratefully acknowledged.